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ROHM Co., Ltd. (6963.T)
| Previous Close | 1,481.50 |
| Open | 1,482.00 |
| Bid | 1,425.50 x 0 |
| Ask | 1,426.00 x 0 |
| Day's Range | 1,422.50 - 1,485.00 |
| 52 Week Range | 1,410.00 - 2,929.50 |
| Volume | |
| Avg. Volume | 5,261,447 |
| Market Cap | 550.41B |
| Beta (5Y Monthly) | 0.70 |
| PE Ratio (TTM) | 32.19 |
| EPS (TTM) | 44.30 |
| Earnings Date | Jan 30, 2025 - Feb 03, 2025 |
| Forward Dividend & Yield | 50.00 (3.37%) |
| Ex-Dividend Date | Mar 28, 2025 |
| 1y Target Est | 1,918.18 |
PR NewswireKulicke & Soffa and ROHM Semiconductor Develop New CuFirst™ Hybrid Bonding Process
Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S", "we" or the "Company"), in collaboration with ROHM Co., Ltd (TYO: 6963) ("ROHM"), a producer of a wide-range of semiconductor devices, announces a new path to hybrid bonding leveraging Kulicke & Soffa's leading Fluxless Thermo-Compression (FTC) process.
GlobeNewswireROHM’s New SiC Schottky Barrier Diodes for High-Voltage xEV Systems: Featuring a Unique Package Design for Improved Insulation Resistance
Achieves approximately 1.3 times the creepage distance compared to standard products ROHM's New Surface Mount SiC Schottky Barrier Diodes Extends creepage distance to a minimum of 5.1mm, approximately 1.3 times greater than standard products Comparison of SiC SBD Package Shape Designs Increasing the creepage distance supresses creepage discharge, eliminates the need for insulation treatment via potting Santa Clara, CA and Kyoto, Japan, Nov. 12, 2024 (GLOBE NEWSWIRE) -- ROHM Semiconductor today a
