Previous Close | 191.24 |
Open | 192.95 |
Bid | 190.21 x 900 |
Ask | 190.43 x 900 |
Day's Range | 189.43 - 193.00 |
52 Week Range | 95.25 - 212.60 |
Volume | |
Avg. Volume | 13,531,157 |
Market Cap | 985.859B |
Beta (5Y Monthly) | 1.23 |
PE Ratio (TTM) | 30.51 |
EPS (TTM) | N/A |
Earnings Date | N/A |
Forward Dividend & Yield | 2.78 (1.46%) |
Ex-Dividend Date | Dec 12, 2024 |
1y Target Est | N/A |
TEMPE, Ariz. & HSINCHU, Taiwan, October 03, 2024--Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona
SANTA CLARA, Calif., April 24, 2024--TSMC (TWSE: 2330, NYSE: TSM) today unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium. TSMC debuted the TSMC A16TM technology, featuring leading nanosheet transistors with innovative backside power rail solution for production in 2026, bringing greatly improved logic density and performance. TSM