- Previous Close
20.15 - Open
20.05 - Bid 19.75 x --
- Ask 19.80 x --
- Day's Range
19.55 - 20.70 - 52 Week Range
13.60 - 26.80 - Volume
2,452,941 - Avg. Volume
683,150 - Market Cap (intraday)
3.463B - Beta (5Y Monthly) 0.53
- PE Ratio (TTM)
-- - EPS (TTM)
-0.80 - Earnings Date --
- Forward Dividend & Yield 0.50 (2.87%)
- Ex-Dividend Date Sep 7, 2023
- 1y Target Est
--
Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies. The company's products include thin small outline, small outline, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, quad flat, LQFP, thermal enhanced, and image sensor packages. It also offers substrate-based package products, such as LGA, VLGA, micro-SD cards, and SD cards. The company was founded in 1998 and is headquartered in Kaohsiung, Taiwan.
www.ticp.com.twRecent News: 3372.TWO
View MorePerformance Overview: 3372.TWO
Trailing total returns as of 10/24/2024, which may include dividends or other distributions. Benchmark is .
YTD Return
1-Year Return
3-Year Return
5-Year Return
Compare To: 3372.TWO
Select to analyze similar companies using key performance metrics; select up to 4 stocks.
Statistics: 3372.TWO
View MoreValuation Measures
Market Cap
3.53B
Enterprise Value
3.05B
Trailing P/E
--
Forward P/E
--
PEG Ratio (5yr expected)
--
Price/Sales (ttm)
3.70
Price/Book (mrq)
1.93
Enterprise Value/Revenue
3.24
Enterprise Value/EBITDA
86.38
Financial Highlights
Profitability and Income Statement
Profit Margin
-14.70%
Return on Assets (ttm)
-5.48%
Return on Equity (ttm)
-7.33%
Revenue (ttm)
943.19M
Net Income Avi to Common (ttm)
-138.68M
Diluted EPS (ttm)
-0.80
Balance Sheet and Cash Flow
Total Cash (mrq)
545.27M
Total Debt/Equity (mrq)
3.62%
Levered Free Cash Flow (ttm)
-45.06M